14 Layer HDI Multilayer FR4 PCB High Green Solder 3 Mil Line Width

14 Layer PCB FR4 Material High Green Solder Mask 3 Mil Line Width

Main Features:

1 A 14 layer printed circuit board with finish board thickness at 2.0mm.

2 Solder mask in green color and white silkscreen.

3 Exposed copper pad surface to do immersion gold treatment.

4 All inner layer copper thickness is half OZ and outer layer copper thickness is 1OZ.

5 Copper wall thickness for plated through holes: 25um

6 ROHS, MSDS, SGS, UL, ISO9001&ISO14001 Certificated

PCB report have to include the following information:

1 Measurement: outline dimension, pcb thickness, plating thickness, actual hole size dimension, copper thickness, hole wall copper thickness, solder mask thickness, track and space width, warp and twist percentage;

2 Test and inspection: electrical test result, solder ability test result, visual inspection test result, micro section pcb with resin;

3 Other: date code, quantity etc.

X-OUT per panel:

1 X-OUT panel must be packed separately and marked clearly

2 A black X must be permanently marked on both sides of pcb

3 X-OUT per panel not be over 25%

4 X-OUT per lot not be over 5%

14 Layer Multilayer FR4 PCB

Green Solder Multilayer FR4 PCB

HDI Multilayer PCB

14 Layer HDI Multilayer FR4 PCB High Green Solder 3 Mil Line Width Images