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100 Ohm HDI PCB 10 Layer 10 MIL 1.6 MM FR4 TG170 Material

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100 Ohm HDI PCB 10 Layer 10 MIL 1.6 MM FR4 TG170 Material

Brand Name : WITGAIN PCB

Model Number : HDIPCB0009

Certification : UL

Place of Origin : China

MOQ : 1pcs/lot

Price : negotiable

Payment Terms : T/T

Supply Ability : 100kpcs/Month

Delivery Time : 25 days

Packaging Details : vacuum package in bubble wrap

Layer Count : 10 Layer

Solder Mask : Green Solder Mask

Board Thickness : 1.6MM

Min Hole : 0.1MM

Copper Thickness : 1/H/H/H/H/H/H/H/H/1

Surface Treatment : Immersion Gold 2U'

Impedance Control : 100 Ohm

BGA Size : 10 MIL

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HDI PCB 10 Layer 1.6 MM Thickness FR4 TG170 Material

PCB Specifications:

1 Part NO: HDIPCB0009

2 Layer Count: 10 Layer HDI PCB

3 Finished Board Thickness: 1.6MM

4 Drilling: L1-L2 0.1MM, L3-L8 0.2MM, L9-L10 0.1MM, L1-L10 0.2MM

5 Min Lind Space&Width: 4/6mil

6 Copper Thickness: 1/H/H/H/H/H/H/H/H/1

7 Application Area: Automobiles

Our production applications:

1 Consumer electronic products: SSD, TWS earphones, headsets,computer devices, portable power supplies, bluetooth modules, gps modules, wifi modules, smart keys for cars, intelligent locks, floor mopping robots, zigbee, etc.

2 Industrial control:main boards in machines, industrial robots, servo motors etc.

3 Automotive: BMS main boards, automotive radar etc.

4 Power supplies: UPS, industrial power supply, frequency power supply.

5 Medical: medical equipment, medical equipment power supply.

6 Communication products: 5G base station, routers, satellites, antennas.

Our Product Categories:

Our Product Categories
Material Kinds Layer Counts Treatments
FR4 Single Layer HASL Lead Free
CEM-1 2 Layer/Double Layer OSP
CEM-3 4 Layer Immersion Gold/ENIG
Aluminum Substrate 6 Layer Hard Gold Plating
Iron Substrate 8 Layer Immersion Silver
PTFE 10 Layer Immersion Tin
PI Polymide 12 Layer Gold fingers
AL2O3 Ceramic Substrate 14 Layer Heavy copper up to 8OZ
Rogers, Isola high frequency materials 16 Layer Half plating holes
Halogen free 18 Layer HDI Laser drilling
Copper based 20 Layer Selective immersion gold
22 Layer immersion gold +OSP
24 Layer Resin filled in vias

Packing Specifications:

1 One vacuum pcb package should not be over 25 panels based on panel size.

2 The vacuum pcb package sealed must be free to tear, hole or any defects that may cause leakage.

3 The pcb package must be suitable to ensure effective vacuum sealing.

4 Every package must have desiccant and humidity indicator card on the inside of vacuum package.

5 Humidity indicator card target less than 10%.


Product Tags:

100 Ohm HDI PCB

      

10 MIL HDI PCB

      

tg170 pcb material

      
China 100 Ohm HDI PCB 10 Layer 10 MIL 1.6 MM FR4 TG170 Material wholesale

100 Ohm HDI PCB 10 Layer 10 MIL 1.6 MM FR4 TG170 Material Images

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